Texturization of silicon wafers with Na2CO3 and Na2CO3/NaHCO3 solutions for heterojunction solar-cell applications

Abstract

Theformationofpyramidalstructuresbyanisotropicetchingof/100S-orientedmono crystalline siliconwafer surfaces is an effectivemethod to reduce reflection losses originatingonthefrontsideofconventionalsiliconsolarcellsandsilicon-heterojunction (SHJ)solarcells.Oneofthemostcommonmethodsoftexturizationusedinthesolar-cell industry isbasedonaqueous solutionsofNaOHorKOHand isopropyl alcohol (IPA). However, IPAis toxicandrelativelyexpensive, soeffortsarebeingmadetoreplace it. Among the potential alternatives, solutions based on Na2CO3 and Na2CO3/NaHCO3 mixtureshavebeenproposed. Inthepresent study, solutionsofNa2CO3 andNa2CO3/ NaHCO3mixtureswerepreparedinordertoformpyramidalstructuresonsiliconwafer surfaces. Itwasnotpossibletoobtainuniformandcompletelytexturedsurfacesbyusing aqueoussolutionsconsistingonlyofNa2CO3.NaHCO3mustbeaddedinordertoachieve uniformtexturedsurfaceswithlowhemispherical reflectancesuitableforSHJ solar-cell applications. Textured surfaceswithgooduniformity and lowaveragehemispherical reflectance (15.4%)wereprepared from/100Ssiliconsubstrateswithrelatively low etchingtimes (25min).Goodsurfacepassivation(lifetime4600msandimplicitopen circuitvoltageof690710mV)onthesep-typetexturedwaferswereachieved.

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